Now the popular of the FPC surface plating is ENIG, but what’s the ENIG? It’s Nickel Immersion Gold.

The flexible circuits copper surface is plated of Ni/Au. The deposition thickness of the inner Ni layer is generally3~6um, the deposition thickness of the outer Au thin, usually 0.03 ~ 0.1um. Ni as the barrier layer between Cu and soldering tin. Welding, outside Au in the solder which melts rapidly with soldering tin and then turn into Ni/Sn intermetallic compounds with inner Ni. The gold-plated to prevent Ni oxidation during storage or passive, it should be enough gold plating density, the thickness can not be too thin.

CMD Circuits almost all flexible circuits are with the ENIG plated for customers, all of our staff are with the many years experience in line, and our customers are very satisfy with our quality when they compare with others’.

Relative Posts:
1. The structure of FPC;
2. the whole thickness of FPCs;
3. Flexible Circuits Production Process.