PCB development trends of advanced manufacturing technology

Summary of domestic and international manufacturing technology for the future development trends of PCB production is basically the same discourse: namely high-density, high precision, small hole diameter, fine wire, fine pitch, high reliability,multi-layered, high-speed transmission, lightweight, thin thickness development, and in production to improve productivity, reduce costs, reduce pollution and meet the many varieties and small batch production direction.
As printed circuit boards level of technological development, we often use the line width, diameter, thickness / diameter ratio as the representative. Please see the level of PCB development process as follows:

Level of development of printed circuit boards technology:

Years
 1970
 1975
 1980
 1985
 1990
 1995
 2000

Aperture (mm)
 1.0
 0.8
 0.6
 0.4
 0.3
 0.15

Width (mm)
 0.25
 0.17
 0.13
 0.10.
 0.08
 0.05

Thickness / aperture ratio
 1.5
 2.5
 5
 10
 20
 40

 Hole density, number of holes / CM2
 4
 7.5
 15
 25
 40
 55

CMD Circuits is engaging in manufacturing the high quality and competitive cost printed circuit boards and flexible pcb for our customers.

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