PCB board(printed circuit board) in the production process, will inevitably cause defects on the electrical due to external factors, such as short circuit,open circuit and leakage power, coupled with continued in the high PCB density, thinner pitch and multi-layer evolution, if failed to be screen out defective boards, and allowed to flow into the manufacturing process,the cost will inevitably cause more waste, so in addition to improved process control, improve the testing technology for the PCB manufacturer can also provide reduce scrap and improve product yield solutions .
In the electronics manufacturing process, due to the cost of the damage caused by defects in various stages of varying degree, the easier it will lower the cost of remedy. “The Rule of 10’s” is a commonly used to assess the process at different stages of PCB was found to be defective when the cost to remedy. So PCB board E-testing is the most improtant.
In the PCB manufacturing process, there are three stages to be tested:
1, inner layer etching
2, after etching the outer line
3, finished
Each stage usually 2 to 3 times the 100% testing, screening out bad board for further re-processing. Therefore, the PCB board E-testing is also a question of process data collection point, the best source, by the results, get open circuit, short circuit and other insulation of the percentage for rework inspection, the use of quality control methods to find root of the problem to be solved.
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